about us

Company History

Company History

2017 ~ Current

2018

  • · Expanded MEMS foundry C&D (Collaboration & Development) business cooperation
  • · Promoted non-memory probe card TRAMS PH (Probe Head) commercialization

2017

  • · Established new corporation WithMEMS. Co., Ltd (split-off)
  • · Established corporate affiliated research institute, and acquired venture company certification and Inno-Biz certification
  • · Acquired quality environmental management system company certification (ISO9001/ISO14001)

2006 ~ 2016

2016

  • · Completed development of 1244Para 300mm large area ceramic MLP for DRAM
  • · Completed development of New P/U of UF-R (Ultra Film-Thin Film Resist) Fuse type
  • · Established GIGATECH corporation at Hefei, China

2015

  • · Completed development of 244Para 300mm large area ceramic MLP for DRAM
  • · Successfully developed UF-S (Ultra Film-Special) 11 um fine pitch P/U (world's first)

2014

  • · Developed and began mass production of high durability Rh-Pin for DRAM
  • · Established MES mass-production quality control system dedicated to MEMS FAB (barcode-based computer system)

2013

  • · Successfully developed Vertical MEMS Trams Pogo Pin and acquired IP (for non-memory)
  • · Developed MEMS RF Switch (civil-military project)
  • · Developed 186um POSI (Probe on Silicon Interposer) Wide I/O project

2012

  • · Developed and mass-produced MEMS Blade P/U for smartphone OLED panel
  • · Developed new UF (Ultra Film) P/U method based on MEMS and acquired IP

2009

  • · Established and transferred MEMS fab of Dongtan Plant

2006

  • · Completed construction and started operation of the first private 8-inch MEMS fab