Owing to application diversification, Integrated Passive Devices (IPDs) are expected to show continuous growth.
The thin film IPD process offers high level of integrity such as miniaturization, low cost and high integration based on fine pitch, excellent tolerance control and high flexibility.
WithMEMS has strengthened its R&D through collaborations to cope with various application-specific requirements such as high-integration passive devices for high frequencies, MIS capacitors with high-Q characteristics, and high-capacity three-dimensional trench capacitors.
