TSV RDL Technology

TSV Technology

TSV is a packaging technology that secures a direct electrical connection path inside the chip by forming a micro-vias that pass through a silicon wafer and then injecting conductive material into the vias.
WithMEMS has secured application technologies for producing various functional substrates and interposers through Si DRIE, Cu Via Fill plating technology, bumping technology, RDL thin film formation and CMP polishing technology.


  • · Via Aspect Ratio 5 : 1 Cu Void Free
  • • Pattern dimension precision: Within ±2 um (Special ± 1 um)
  • • Pattern line pitch of minimum 35 um available (Special 11 um pitch)


  • • MEMS substrate, Interposer using insulation layer, space transformer, etc.