CMP Technology

CMP Technology

CMP (Chemical Mechanical Polishing) is a process that polishes and planarizes the surface layer of the material with chemical and mechanical method by injecting polishing slurry and having the polishing pad and the material surface rub against each other.
It is an essential core process in the fabrication and lamination processes for MEMS structures. Our MEMS CMP (Chemical Mechanical Polishing) process capability for various materials such as Silicon Wafer, Silicon Nitride (Si3N4), SiC, Sapphire, Quartz, Glass and Polyimide as well as various specifications are the best in Korea.


  • • Possesses precision Temporary Bonding technology utilizing inhouse-developed Semi-Automated Wax Mounting equipment
  • • Possesses MLC (300mm) board lamination PI CMP technology and interlayer repair technology (±1 - 2 um TTV control)
  • • Possesses Micro Probe Tip (Rh) Precision CMP technology (terminal R value control)
  • • CMP processing capability (Minimum thickness/tolerance)
2" 4" 6" 8" 12"
50um /±1um 50um /±1um 50um /±1um 90um /±1um 100um /±2um


  • · MEMS Probe, Ultra Film, Ceramic Thin-Film MLP, Silicon Wafer, Ceramic Guide Plate Processing, etc
  • · Si3N4, GaAs, SiO2, Metal(NiCo, Au, SUS etc), Polymer(PR, PI)