We have the manufacturing technology of high-precision MLP (Multi Layer Polyimide) laminated circuit board with large area of 300 mm using 12-inch based Lithography, Electro Plating and CMP key core technologies.
Features
• Polyimide Multi-layer laminated circuit board with more than 6 layers manufactured on 300mm HTCC/LTCC board
• Total measurement of O/S and leakage by layer using BBT test
• Repair supported through AOI/AOR
• Embedded thin film resist (TaN thin film resistor) under development
