MLP Technology

Thin-Film MLP Technology

We have the manufacturing technology of high-precision MLP (Multi Layer Polyimide) laminated circuit board with large area of 300 mm using 12-inch based Lithography, Electro Plating and CMP key core technologies.


  • • Polyimide Multi-layer laminated circuit board with more than 6 layers manufactured on 300mm HTCC/LTCC board
  • • Total measurement of O/S and leakage by layer using BBT test
  • • Repair supported through AOI/AOR
  • • Embedded thin film resist (TaN thin film resistor) under development


  • · DRAM/NAND 300mm Probe Card용 Ceramic S/T(Space Transformer), Non-Memory Interposer, etc