MEMS FOUNDRY SOLUTIONS
Based on its accumulated experience and know-how, WithMEMS Co., Ltd. provides various unit process development, prototype development and mass production MEMS foundry services to meet customers‘s needs.
- · Photolithography : 8inch/12inch, Both side alignment available
- · Thin Film Deposition : Sputter/Evaporation, Ti, Cu, NiCr, Al, Zr, TaN, Au etc
- · Etching : 8inch Silicon DRIE, Polyimide RIE, SiO2, PZT, TaN etc
- · Electro/Electroless Plating : Cu, Ni, NiCo, Au, SnAg, Rh, Pd etc
- · CMP : Si, Si3N4, SiC, GaAs, SiO2, Metal(NiCo, Au, SUS etc), Polymer(PR, PI) etc
- · Dicing : Si, SiC, Glass, Al2O3 etc
- · Analysis : SEM, EDS, X-RAY, Surface Profile, AFM, AOI, AOR, BBT etc