MEMS FOUNDRY SOLUTIONS
WithMEMS股份有限公司以积累的经验和技术为基础,为应对客户的需求,提供各种单位工程开发、试制品开发及量产代工(MEMS Foundry)服务。
- · Photolithography : 8inch/12inch, Both side alignment available
- · Thin Film Deposition : Sputter/Evaporation, Ti, Cu, NiCr, Al, Zr, TaN, Au etc
- · Etching : 8inch Silicon DRIE, Polyimide RIE, SiO2, PZT, TaN etc
- · Electro/Electroless Plating : Cu, Ni, NiCo, Au, SnAg, Rh, Pd etc
- · CMP : Si, Si3N4, SiC, GaAs, SiO2, Metal(NiCo, Au, SUS etc), Polymer(PR, PI) etc
- · Dicing : Si, SiC, Glass, Al2O3 etc
- · Analysis : SEM, EDS, X-RAY, Surface Profile, AFM, AOI, AOR, BBT etc